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Tomorrow's business is won by today's quality.
1 Years
| Ask Lasest Price | |
| Brand Name : | Winsmart |
| Model Number : | SMTID5X |
| Certification : | CE |
| Price : | USD15000-50000/unit |
| Payment Terms : | T/T |
| Supply Ability : | 300 units per year |
| Delivery Time : | 14-20 working days |
A Four-Axis Visual High-Speed Dispensing Machine is an advanced
automation system designed for precise, high-speed application of
adhesives, sealants, or other fluids in electronic and industrial
assembly lines. The "four-axis" refers to X, Y, Z, and rotational
R-axismotion control, enabling the nozzle to dispense at complex
angles and orientations.
Equipped with a vision system, it automatically recognizes
positioning marks (fiducials) to adjust dispensing paths in real
time, ensuring high precision and repeatable accuracy — even on
intricate or irregular surfaces.
This type of machine is commonly used in high-volume manufacturing
environments for SMT, semiconductor packaging, LED modules, and
mobile device assembly.
Inverters, energy storage, photovoltaics, power supplies, automotive electronics, electronic cigarettes, 3C, semiconductors, etc.
Model | SMTID5X |
Automatic Glue Dispenser | Yes |
Dispensing Head | 360°Rotatable (Optional) |
Glue Capacity | 2600ml |
Dispensing Tilt Angle | 180°(Optional) |
Glue Detection | Auto(Optional) |
Programming | Visual CCD |
Axes | 4 |
Working Area | 400mm*400*100mm |
Max Moving Speed | 1000mm/s |
Driven | Servo motor+ball screw |
Air Pressure | ≥0.65Mpa |
Power Rate | 1.5KW |
Dispensing Valve Quantity | 1 |
Repeatability Accuracy | ±0.02mm |
Control Mode | IPC + control Card |
Y Axis | 200mm |
Machine Dimension | 1200(L)x1400(W)x1650(H)mm |
Machine Weight | 300kgs |
| Application | Description |
| Mobile Phone Assembly | Used for sealing, gluing, or underfill in smartphone components like camera modules and screens. |
| LED Packaging | Applies phosphor, silicones, or adhesives precisely on LED chips and modules. |
| Display Panel Bonding | Dispensing UV glue or bonding agents in TVs, monitors, and touch panels. |
| Semiconductor Packaging | Underfill, dam & fill, and encapsulation processes for ICs and MEMS devices. |
| Automotive Electronics | High-reliability adhesive application for ECUs, sensors, and control modules. |
| Battery & Energy Products | Applies thermal interface materials (TIMs), sealants, or adhesives in battery cells. |
| PCB Assembly (SMT) | Applies glue for component fixation, especially on double-sided boards. |
| Medical Devices |
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